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Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); K...

Description: Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1489983244, ISBN-13 9781489983244, Brand New, Free P&P in the UK RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Price: 125.99 GBP

Location: Castle Donington

End Time: 2024-12-13T10:14:59.000Z

Shipping Cost: 20.28 GBP

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Rf and Microwave Microelectronics Packaging, Paperback by Kuang, Ken (EDT); K...

Item Specifics

Return postage will be paid by: Buyer

Returns Accepted: Returns Accepted

After receiving the item, your buyer should cancel the purchase within: 30 days

Book Title: Rf and Microwave Microelectronics Packaging

Number of Pages: 285 Pages

Language: English

Publication Name: Rf and Microwave Microelectronics Packaging

Publisher: Springer-Verlag New York Inc.

Publication Year: 2014

Subject: Engineering & Technology, Physics

Item Height: 235 mm

Item Weight: 468 g

Type: Textbook

Author: Ken Kuang, Franklin Kim, Sean S. Cahill

Subject Area: Manufacturing Engineering

Item Width: 155 mm

Format: Paperback

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