Description: RF and Microwave Microelectronics Packaging, Hardcover by Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT), ISBN 1441909834, ISBN-13 9781441909831, Like New Used, Free shipping in the US This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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Book Title: RF and Microwave Microelectronics Packaging
Number of Pages: Xvi, 285 Pages
Publication Name: RF and Microwave Microelectronics Packaging
Language: English
Publisher: Springer
Subject: Electronics / Microelectronics, Radio, Telecommunications, Electronics / General, Microwaves
Publication Year: 2009
Type: Textbook
Item Weight: 46.9 Oz
Item Length: 9.3 in
Author: Franklin Kim
Subject Area: Technology & Engineering
Item Width: 6.1 in
Format: Hardcover
