Description: New Hard cover
Price: 220.54 USD
Location: Sparks, Nevada
End Time: 2025-02-06T11:10:23.000Z
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Book Title: Packaging of High Power Semiconductor Lasers
Publication Date: 2014-07-15
Number of Pages: Xv, 402 Pages
Publication Name: Packaging of HIGH POWER Semiconductor Lasers
Language: English
Publisher: Springer New York
Subject: Industrial Design / Packaging, Electronics / Semiconductors, Power Resources / Electrical, Power Resources / General
Publication Year: 2014
Item Weight: 29.7 Oz
Type: Textbook
Item Length: 9.3 in
Author: Lingling Xiong, Xingsheng Liu, Wei Zhao, Hui Liu
Subject Area: Technology & Engineering
Series: Micro- and Opto-Electronic Materials, Structures, and Systems Ser.
Item Width: 6.1 in
Format: Hardcover
