Description: Electrical Design of Through Silicon Via, Paperback by Lee, Manho (EDT); Pak, Jun So (EDT); Kim, Joungho (EDT), ISBN 940177949X, ISBN-13 9789401779494, Like New Used, Free shipping in the US Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
Price: 135.35 USD
Location: Jessup, Maryland
End Time: 2025-01-16T12:17:21.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 14 Days
Refund will be given as: Money Back
Return policy details:
Book Title: Electrical Design of Through Silicon Via
Number of Pages: IX, 280 Pages
Language: English
Publisher: Springer Netherlands
Topic: Systems Architecture / General, Electronics / Circuits / Integrated, Electronics / Circuits / General
Publication Year: 2016
Illustrator: Yes
Genre: Computers, Technology & Engineering
Item Weight: 157.1 Oz
Author: Jun So Pak
Item Length: 9.3 in
Item Width: 6.1 in
Format: Trade Paperback
