Description: Distributed, Ambient, and Pervasive Interactions Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). Third International Conference, DAPI 2015, Held as Part of HCI International 2015, Los Angeles, CA, USA, August 2-7, 2015, Proceedings Author(s): Norbert Streitz, Panos Markopoulos Format: Paperback Publisher: Springer International Publishing AG, Switzerland Imprint: Springer International Publishing AG ISBN-13: 9783319208039, 978-3319208039 Synopsis This book constitutes the refereed proceedings of the Third International Conference on Distributed, Ambient, and Pervasive Interactions, DAPI 2015, held as part of the 17th International Conference on Human-Computer Interaction, HCII 2015, held in Los Angeles, CA, USA, in August 2015, jointly with 15 other thematically conferences. The total of 1462 papers and 246 posters presented at the HCII 2015 conferences were carefully reviewed and selected from 4843 submissions. These papers address the latest research and development efforts and highlight the human aspects of design and use of computing systems. The papers accepted for presentation thoroughly cover the entire field of human-computer interaction, addressing major advances in knowledge and effective use of computers in a variety of application areas. This volume contains papers addressing the following major topics: designing and developing intelligent environments; natural interaction; design and development of distributed, ambient and pervasive interactions; smart devices, objects and materials; location, motion and activity recognition; smart cities and communities; and humor in ambient intelligence.
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End Time: 2024-02-26T08:48:11.000Z
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Book Title: Distributed, Ambient, and Pervasive Interactions
Item Height: 235mm
Item Width: 155mm
Author: Norbert Streitz, Panos Markopoulos
Publication Name: Distributed, Ambient, and Pervasive Interactions: Third International Conference, DAPI 2015, Held as Part of HCI International 2015, Los Angeles, CA, USA, August 2-7, 2015, Proceedings
Format: Paperback
Language: English
Publisher: Springer International Publishing A&G
Subject: Engineering & Technology, Social Sciences, Computer Science
Publication Year: 2015
Type: Textbook
Number of Pages: 702 Pages