Description: Copper Wire Bonding by Anupam Choubey, Preeti S. Chauhan, ZhaoWei Zhong, Michael G. Pecht Estimated delivery 3-12 business days Format Hardcover Condition Brand New Description Copper Wire Bonding Publisher Description This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.In summary, this book:Introduces copper wire bonding technologiesPresents copper wire bonding processesDiscusses copper wire bonding metallurgiesCovers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishesCovers the reliability tests and concernsCovers the current implementation of copper wire bonding in the electronicsindustry Features 120 figures and tablesCopper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology. Author Biography Preeti Chauhan is a Graduate Research Assistant in the Center for Advanced Life Cycle Engineering at the University of Maryland. Anupam Choubey is a consultant in the area of packaging engineering in the Boston, MA area. ZhaoWei Zhong is a Professor of Mechanical and Aerospace Engineering at Nanyang Technological University. Michael Pecht is a world renowned reliability engineer and educator. He is the founder and Director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland. Details ISBN 1461457602 ISBN-13 9781461457602 Title Copper Wire Bonding Author Anupam Choubey, Preeti S. Chauhan, ZhaoWei Zhong, Michael G. Pecht Format Hardcover Year 2013 Pages 235 Edition 2014th Publisher Springer-Verlag New York Inc. GE_Item_ID:137723161; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys
Price: 167.84 USD
Location: Fairfield, Ohio
End Time: 2024-12-24T03:03:34.000Z
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Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
ISBN-13: 9781461457602
Book Title: Copper Wire Bonding
Number of Pages: Xxvi, 235 Pages
Language: English
Publication Name: Copper Wire Bonding
Publisher: Springer New York
Publication Year: 2013
Subject: Mechanical, Electrical, Manufacturing, Chemistry / Inorganic
Item Weight: 183.7 Oz
Type: Textbook
Author: Preeti S. Chauhan, Anupam Choubey, Zhaowei Zhong, Michael G. Pecht
Item Length: 9.3 in
Subject Area: Technology & Engineering, Science
Item Width: 6.1 in
Format: Hardcover