AMTECH NC-559-ASM BGA Soldering Tin Cream Paste for Mobile Phone Motherboard

Description: PHONEFIX 100% Original AMTECH Unleaded NC-559-ASM BGA Soldering Tin Cream+Syringe Push+Needle Head for Phone PCB Welding 10CC Low Residue SMD Soldering Paste Flux Product specification Original 10CC AMTECH NC-559-ASM BGA lead-free solder paste, easy to use. Lead-free solder paste had transparent residue and low solder ball rate, possess excellent wetting ability on PCB. Transparent Residue, No Halogen. Multi-function: for phone PCB BGA repair, and other electronics welding, soldering. This type of solder paste composed of environment-friendly flux and low oxidation spherical powder,which were characterized by long continuous repeatability printing time,high print definition,excellent solderability. Option Option 1: 1 Piece of NC-559-ASM BGA Solder OPtion 2: 2 Pieces of NC-559-ASM BGA Solder Product Specifications Weight: 0.08kg Flux Type: NC-559-ASM Volume:10cc Net weight: 10ml Model: XG-50 Design: Needle-Tube Material: Lead-free Tin + Solder Paste With Booster: Yes Insulated: Yes Application: for Phone BGA Reballing Function: for Phone PCB BGA repair, Electronics welding, soldering Color: Transparent Is-Customized: No Length of Booster: 95mm Condition: Full New Product Package One piece / two pieces of flux paste

Price: 7.7 USD

Location: China

End Time: 2024-09-11T22:21:59.000Z

Shipping Cost: 4.9 USD