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Book Title: Advanced Materials for Thermal Management of Electronic Packaging
Publication Date: 2011-01-10
Pages: 618
Number of Pages: Xxii, 618 Pages
Publication Name: Advanced Materials for Thermal Management of Electronic Packaging
Language: English
Publisher: Springer New York
Subject: Industrial Design / Packaging, Electronics / Circuits / General, Materials Science / Electronic Materials, Electronics / General, Mechanics / Thermodynamics
Publication Year: 2011
Type: Textbook
Item Weight: 39.4 Oz
Author: Xingcun Colin Tong
Subject Area: Technology & Engineering, Science
Item Length: 9.3 in
Item Width: 6.1 in
Series: Springer Series in Advanced Microelectronics Ser.
Format: Hardcover
