5 Thermal Compound (2 Pack)

Description: 5 High-Density Polysynthetic Silver Thermal Compound 3.5g AS5-3.5G 5 premium thermal compound, with 99.9% pure micronized silver, is specifically designed to maximize the thermal conductivity between today's high-powered processors and high-performance cooling assemblies. 5 uses three unique shapes and sizes of near-pure silver particles to maximize particle-to-particle area and thermal transfer. It can reduce CPU core temperatures by up to 50°F over standard silicone thermal pastes. Controlled triple phase viscosity allows 5 to fill, over time, microscopic valleys and gaps in CPU and heatsink surfaces. 3.5g tube can cover up to 25 CPU cores. Made With 99.9% Pure Silver: 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle area and thermal transfer. High-Density: 5 contains over 88% thermally conductive filler by weight. In addition to micronized silver, 5 also contains sub-micron oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability Controlled Triple-Phase Viscosity: 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the , 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability. Premium silver polysynthetic thermal compound Use between CPUs and heatsinks or water-cooling solutions Will not separate run migrate or bleed Does not contain any silicone 3.5 gram tube will cover 20 to 30 small cpus

Price: 21.97 USD

Location: Brooklyn, New York

End Time: 2024-12-03T09:52:17.000Z

Shipping Cost: 0 USD